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RCC 12 Mic HTE Red Electrolytic Copper Foil For Polyimide Board

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RCC 12 Mic HTE Red Electrolytic Copper Foil For Polyimide Board

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Brand Name : JIMA

Model Number : EDCU-HC

Certification : SGS, ISO,Reach, RoHS

Place of Origin : china

MOQ : 100kg

Price : negotiation

Payment Terms : T/T, L/C

Supply Ability : 1000 Ton per month

Delivery Time : 5-15 days

Packaging Details : wooden carton

Elongation : ≥ 1.5%

Anti oxidation : 180 degree 60 minutes, 180 days 23 degree

Thickness : 1/2 oz,3/4 oz,1 oz,2 oz,

Color : red or black

Name : Polyimide Board Copper Tooling Foil , 1-2oz Copper Thin Sheet

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RCC 12 Mic HTE Red Electrolytic Copper Foil for Polyimide Board.

Polyimide Board Copper Tooling Foil , 1-2oz Copper Thin Sheet

Products Classify:

  • The ED copper foils for PCB can be divided into below parts:
  • (STD-E)- standard electrodeposited copper foil.
  • (HD-E)-high ductility electrodeposited copper foil.

Products Specification:

  • Single side side treatment in red.
  • Thickness: 12um.
  • Width: 5-1380mm.

Feature Description:

  • Perfect normal temperature storage performance.
  • High temperature anti-oxidization performance.
  • High temperature elongation performance.

Products Application:

  • Polyimide board.
  • Epoxy board.

FAQ:

Q1: What's your guarantee?

A1: All our products have 6 months guarantee after received goods, if any quality problem can contact us.

Q2: What's your delivery time ?

A2: The common delivery time is 5-35 working days. The specific delivery time depends on the items and the quantity of your order.

HTE Copper Foil with High Elongation Copper Foil at High Temperature

Thickness um 9 12 18 25 35 70

IPC 4562

4.6.3.1

Area weight g/m² 80±1 107±3 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2

Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9

(RZ) μm <6.0 <6.5 <8.0 <9.0 ≤10.0 <15

Copper≧

% 99.8

IPC 4562

4.6.3.1

Tensile Strength state normal Mpa >300 >300 >300 >300 >300 >280

IPC 4562

4.6.4

state temper (180℃) Mpa >15.0 >18.0 >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >3.0 >3.0 >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3

state temper (180℃) % >2.0 >2.5 >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.0 >1.05 >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12

3. Standard Width,1295(±1)mm,May according to the customer request tailor.

We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.


Product Tags:

12 Mic Electrolytic Copper Foil

      

Polyimide Board Electrolytic Copper Foil

      

HTE Rolled Copper Foil

      
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